Viking Technology, a division of Sanmina Corporation, announces their newly released 16GB DDR4 Multi-Chip Package (MCP).
Packaging
European Chips Skills Academy Launches Summer School in Italy to Promote Microelectronics Industry Careers
University students will connect with professors to explore semiconductor learning paths and employment opportunities at the European Chip Skills Academy Summer School, August 18-23, 2024 in Bologna, Italy.
RISC-V Adoption Will Be Accelerated by AI, According to New Omdia Research
RISC-V processors will account for almost a quarter of the global market by 2030, according to new research by Omdia.
RS Offers Banner Engineering’s Extensive Portfolio of Sensor Products for Industrial Automation Applications
The comprehensive RS selection of Banner sensors includes an array of sensing technologies — including photoelectric, laser, and radar — and can help improve the accuracy, productivity, uptime, and efficiency of almost any industrial automation application.
Honda and IBM Sign MOU to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies
Agreement outlines intent to research and develop solutions to new challenges related to processing performance, power consumption, and design complexity.
Pfeiffer Vacuum Supports Young Scientist Award for Accelerator Physics Conferred by the German Physical Society
Dr. Sebastian Keckert is awarded this year’s Young Scientist Award for Accelerator Physics by the German Physical Society (DPG).
SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
SEMICON West 2024 will gather industry experts and leaders July 9-11 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.
EV Group Highlights Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration at ECTC 2024
Papers to highlight breakthrough capabilities of EVG’s hybrid bonding, LITHOSCALE maskless lithography and IR layer release technology for advanced packaging applications.
New SEMI University Online Certification Programs to Fast-Track Semiconductor Skills Development
Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI today announced that its SEMI University learning platform now offers online course certification programs designed to fast-track semiconductor career development.
Chips Industry May Not Be Fit For Purpose By 2030, Says GlobalData
Next-generation chips represent the next frontier of semiconductor technology, incorporating advancements in design, materials, manufacturing process, performance, and packaging. As computing tasks become more demanding and data-intensive, next-generation chips promise faster speeds and better energy efficiency.
