MAGAZINE
March
JCET Q1 2024 Revenue and Net Profit Achieve Double-digit Year-on-Year Growth
JCET Group, a global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2024.
Opening Up the Potential of Thin-Film Electronics for Flexible Chip Design
New research demonstrates feasibility of ‘foundry’ model for flexible electronics.
A Flexible Microdisplay Can Monitor Brain Activity in Real-Time During Brain Surgery
The device represents a huge leap ahead to visualize brain activity to guide neurosurgeons.
Semiconductor Wet Chemicals Growth Underway
Suppliers remain “expansion-ready” for incoming fabs.
ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement
ROHM and STMicroelectronics announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.
Axcelis Wins the Texas Instruments 2023 Supplier Excellence Award
Axcelis Technologies, Inc., a supplier of enabling ion implantation solutions for the semiconductor industry, has received the Texas Instruments (TI) 2023 Supplier Excellence Award
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
Samsung Electronics Co., Ltd. today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
The 2024 IEEE Symposium on VLSI Technology & Circuits To Showcase Breakthroughs in Microelectronics
For the last 44 years, the IEEE Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits for the microelectronics industry, with maximum synergy between both domains.
Syensqo Joins the SEMI Climate Consortium
The partnership aims to accelerate implementation of a sustainability roadmap across the entire value chain.
Lattice Wins 2024 Environment + Energy Leader Award
Lattice Semiconductor, the low power programmable leader, today announced its Lattice Avant FPGA platform was selected as a 2024 Environment + Energy Leader Award winner.
Silicon Creations Reaches Milestone of 10 Million Wafers in Production with TSMC
Silicon Creations, a supplier of high-performance analog and mixed-signal intellectual property (IP), announced a significant milestone: surpassing 10 million wafers in production containing Silicon Creations IP in collaboration with TSMC.
US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C
The U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes – Commercial (RAMP-C) program.
GlobalFoundries Commits to Achieving Net Zero Emissions and Carbon-Neutral Power by 2050
New goals target additional reductions and removal of greenhouse gas emissions to help fight climate change.
SEMI Applauds U.S. CHIPS Act Award for Samsung Electronics Facilities
The award includes $6.4 billion in grants and an investment tax credit to help fund two new leading-edge logic fabs, a research and development fab, and an advanced packaging facility in Taylor, Texas.
Aaron Woolf, Dylan Peterson Join SIA Team
Woolf will serve as director of global policy for economic security and Peterson will be a communications associate.
Silicontent and yieldWerx Announce Collaboration
yieldWerx continues to partner with global semiconductor companies and has partnered with Silicontent to bring improvements in yield management and quality.
SK hynix Partners with TSMC
SK hynix Inc. announced today that it has recently signed a memorandum of understanding with TSMC for collaboration to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology.
Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
Omni Design Technologies, a provider of high-performance, low-power mixed-signal intellectual property (IP), today announced it has joined the Intel Foundry Accelerator IP Alliance.
Properties of New Materials for Microchips Can Now Be Measured Well
Reseachers of Delft University of Technology demonstrated measuring performance properties of ultrathin silicon membranes.
Silvaco Expands Partnership with Micron
Silvaco Group, Inc., a provider of TCAD, EDA software, and SIP solutions that enable semiconductor design and AI through software and innovation, today announced an enhanced partnership with Micron Technology, Inc.
With High NA EUV, Intel Foundry Opens New Frontier in Chipmaking
Intel is industry’s first mover on High NA EUV, enabling continued process leadership beyond Intel 18A.
Brooks Instrument Acquires Creative Machining Technology
Acquisition strengthens the company’s ability to produce ultrahigh-purity components for critical markets like semiconductor manufacturing.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth.
Featured Video
Winnie Nabea, Global Product Manager at Mettler-Toledo Thornton, explains the importance of monitoring silica in ultra-high purity (UHP) water used in semiconductor manufacturing plants. Silica is one of the most critical indicators of the health of the water system. A rise in silica levels means the resin is approaching exhaustion and needs to be regenerated. If silica is not monitored, contamination of the ultrapure water can occur. She explains where silica should be monitored, outside factors that may cause silica issues, the best methods for monitoring silica, and how Mettler-Toledo is helping semiconductor manufacturers monitor the overall health of their water treatment plants.
Semiconductor Daily Digest in your inbox
Featured Products
EVENTS
April
May
June